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1
interlayer connection中文是什么意思
发音:
- 中文翻译
- 造句
- 层间连接
- interlayer n. 【建筑】夹层，间层；【物理学】界层，隔层。
- connection n. 〔美国〕＝connexion.
- adhesive interlayer 胶浆夹层
- bubble in the interlayer 胶合层气泡
- cathode interlayer 阴极介层
- fabric interlayer 夹布层
- foamed interlayer 发泡中间层
- interlayer bonding 层间联结; 层间连接
- interlayer cation 层间阳离子
- interlayer contact 层间接触
- interlayer continuity 层间连接
- interlayer coupling 层间偶（耦）合
- interlayer crossflow 层间对流
- interlayer dielectric 层间绝缘
- interlayer dirt 胶合层杂质
- interlayer effect 层间效应; 界层效层; 界层效应
- interlayer interference 层间干扰
- interlayer ions 层间离子
- interlayer isolation 层间绝缘
- interlayer metallization 层间金属化
- interlayer mixture 间层混合物
- interlayer potassium 层间钾
- interlayer pressure 层间压力
- interlayer sheet 夹层片材
- interlayer sorption 层间吸留
- Specification for single and double sided carbon - coated printed boards without interlayer connection
无金属化孔单双面碳膜印制板规范 - Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification
印制电路板.层间连接刚性印制电路板.分规范 - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections - sectional specification
印制电路板.第4部分:有扁导线的硬质多层印制电路板分规范 - Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.分规范 - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification iec 62326 - 4 : 1996 ; german version en 62326 - 4 : 1997
印制电路板.第4部分:层间连接刚性多层印制电路板.分 - Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification - capability detail specification - performance levels , a , b and c
印制电路板.层间连接刚性印制电路板.分规范.性能详细规格. a , b和c级性能水平 - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections - sectional specification - section 1 : capability detail specification - performance levels a , b and c
印制板.第4部分:层连接的刚性多层印制板.分规范.第1节:性能详细规范.性能水平a b和c - Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification . section 1 : capability detail specification performance levels a , b and c
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.第1节:容量详细规范性能等级a b和c - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification ; section 1 : capability detail specification ; performance levels a , b and c iec 62326 - 4 - 1 : 1996 ; german version en 62326 - 4 - 1 : 1997
印制电路板.第4部分:层间连接刚性多层印制电路板.分
- interlayer connectionとは意味：層間接続｛そうかん せつぞく｝
- 推荐英语阅读
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Last modified time:Mon, 11 Aug 2025 00:29:56 GMT
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